Thermal Dissipation

發(fā)表時(shí)間：2022-07-02 23:37

可處理芯片或晶圓

極佳的薄膜結(jié)合力

大幅降低熱阻

產(chǎn)能 : 20min/Tray
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Add: 4/F, Building 1, Zhiyan Innovation Building, Tianliao Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen